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应用案例

绝缘树脂

固体树脂

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特种耐热树脂（铺满的效果）

　　高纯度耐热特种树脂

　　本产品纯度可达99%以上，远超市场95%的常规纯度，具有耐高温(分解温度﹥420℃)、绝缘强度高、力学性能良好的特点，是性能优异的耐热结构材料，和H级、C级及以上电气绝缘材料的理想树脂基体。

　　本产品适用于无机基材基体树脂印制电路板(即芯片)的制造，可作为雷达、航天、导弹的结构材料以及200级以上电气绝缘材料的树脂基体材料。

　　High purity heat-resistant specialty resin

　　The purity of this product can reach more than 99%, far exceeding the conventional purity of 95% on the market. This product has the characteristics of high temperature resistance (decomposition temperature > 420 °C), high dielectric strength and good mechanical properties, and is a heat-resistant structural material with excellent performance, and also an ideal resin matrix for H-class, C-class and above electrical insulation materials.

　　This product is suitable for the manufacture of printed circuit boards (i.e., chips) based on inorganic substrate, can also be used as the structural material of radar, aerospace, missile, and as a resin matrix material of electrical insulation materials above 200℃.